By reflow I simply mean heat the solder joints up using a normal soldering iron and add a little fresh solder, if only for the flux, to make joints flow and "heal" again.
Yes, the board is double-sided with fairly few vias, but the board material and changing temperature plays a role in that the
connection breaks inside the via. Reflowing may not be a lasting solution and jumper wires is what B&O recommended in the tech note.
I seem to remember some boards that can't be reflowed, because there really aren't any solder pads at the vias, but merely a small hole.
Not unlike the Beogram CD X, where vias are actual metal rivets that has been riveted and then filled with solder. They develop cracks and
becomes intermittent, not around the rivet heads as one might expect but somewhere down through the hole.
The rivets provide ground potential from one side of the board to their respective circuits on the other side and, particularly in combinations, they can
cause the strangest faults.
The best (and sometimes only lasting) cure here is to suck out all old solder, feed a lead through the hole in the rivet (they are fairly large so
no problem) and solder the lead to tracks on both sides.
The same board principle can be found in some early 1980s car stereos - knowing that temperature changes has influence imagine the
problems they can cause here,
Martin