Can anyone tell me the reason for these horseshoe shaped solder pads? They are clearly marked on the layout diagram for the power supply board on the Beocenter 4000 (also Beomaster 2200) in the locations for IC1 and TR3 which are mounted on the large heatsink at the rear of the board.
I thought at first the pads might have lifted or been damaged but the diagram shows the horseshoe shape.
Is this to lessen thermal stress in the soldered connection?